resin composition for fixing rotor, rotor and automotive vehicle

专利摘要:
RESIN COMPOSITION FOR FIXING ROTOR, ROTOR AND AUTOMOTIVE VEHICLE. A rotor fastening resin composition of the present invention comprising: a thermosetting resin containing epoxy resin; a healing agent; and an inorganic filler, wherein an a-break stress elongation is 0.1% or greater and 1.7% or less, wherein the a-break stress elongation is obtained by subjecting a piece of test to a tensile test in accordance with JIS K7162 under conditions of a temperature of 120 °C, a test force of 20 MPa and 100 hours and the test piece is a cured product produced by subjecting the resin composition for fixing rotor to cure by heating to 175 °C for 4 hours and molding into a dumbbell shape in accordance with JIS K7162.
公开号:BR112014020987B1
申请号:R112014020987-1
申请日:2013-02-28
公开日:2021-05-04
发明作者:Tetsuya Kitada；Kohji Muto
申请人:Sumitomo Bakelite Co., Ltd；
IPC主号:

专利说明:

FIELD OF TECHNIQUE
[0001] The present invention relates to a resin composition for fixing a rotor, a rotor and an automobile.
[0002] Priority is claimed in Patent Application No. JP 2012 045885, filed on March 1, 2012, incorporated herein in its entirety by reference. BACKGROUND TECHNIQUE
[0003] In relation to an engine mounted in an automobile, etc., the techniques to improve its strength have been studied. The technique described in Patent Literature 1 refers to an engine seal resin molding material that is used to seal an engine. In other words, it can be considered that the molding material described in Patent Literature 1 is used for a housing that seals a motor.
[0004] Patent Literatures 2 to 6 describe the techniques in relation to a rotor that constitutes a motor. A rotor includes a rotor core having an orifice portion and a permanent magnet inserted in the orifice portion.
[0005] For example, Patent Literature 2 describes the technique of filling a slit, which is provided so as to be communicated with a housing hole to house a permanent magnet, with a resin. Furthermore, Patent Literature 2 discloses that such a slit is formed at both end portions in a circumferential direction of a housing hole to house a permanent magnet in order to increase an amount of magnetic flux passing through a stator.
[0006] Furthermore, Patent Literatures 3 to 5 describe the techniques of making a magnet adhere to a rotor core.
[0007] Patent Literature 3 describes the technique of making a permanent magnet adhere to a rotor core with the use of an adhesive coated directly onto a permanent magnet.
[0008] Patent Literature 4 describes the technique of inserting a permanent magnet into a slot of a rotor core in which an adhesive agent has been placed previously and thermally curing an adhesive agent in the condition after turning a rotor upside down.
[0009] Patent Literature 5 describes the technique of attaching a cured adhesive agent to a concave part and a convex part formed on the surface of a magnet or on the interior surface of a slit to insert a magnet and an adhesive agent.
[00010] Furthermore, Patent Literature 6 describes the technique of attaching a magnet to a rotor core with the use of a resin portion to a hole portion to insert a magnet. Specifically, Patent Literature 6 describes the technique in which a filling portion, which is formed between a hole portion and a magnet embedded in a hole portion, is formed by injecting a portion of resin into a hole portion. starting from the portion facing a central portion in a wide direction of a magnet in the opening of an orifice portion.
[00011] Patent Literature 7 describes the technique in relation to a resin. Specifically, Patent Literature 7 refers to a semiconductor sealing epoxy resin composition and controlling the grain size distribution thereof. QUOTE LIST PATENT LITERATURE PATENT LITERATURE 1
[00012] Unexamined Patent Application, First Publication No. JP 2009-13213 PATENT LITERATURE 2
[00013] Unexamined Patent Application, First Publication No. JP 2002-359942 PATENT LITERATURE 3
[00014] Unexamined Patent Application, First Publication No. JP 2003-199303 PATENT LITERATURE 4
[00015] Unexamined Patent Application, First Publication No. JP 2005-304247 PATENT LITERATURE 5
[00016] Publication of Patent Application Open to Public Inspectorate No. JP Hei 11-98735 PATENT LITERATURE 6
[00017] Unexamined Patent Application, First Publication No. JP 2007-236020 PATENT LITERATURE 7
[00018] Unexamined Patent Application, First Publication No. JP 2010-159400 SUMMARY OF THE INVENTION TECHNICAL PROBLEM
[00019] A rotor core is used under high speed rotation at a high temperature for a long time. Currently, it is desired to further downgrade an engine to drive an automobile and an engine capable of more high speed rotation is required for downtime. Thus, the improvement in durability during high speed rotation is strongly desired for a rotor core.
[00020] When a motor is under high speed rotation, a large centrifugal force acts on a permanent magnet embedded within a rotor core. It is desired to obtain a structure that does not cause misalignment and deformation of a magnet even if a centrifugal force acts on a magnet. In order to achieve this type of structure, the optimal design of a clamping member to attach a rotor core to a magnet is the important technical problem.
[00021] Therefore, an objective of the present invention is to provide a rotor fastening resin composition in order to obtain a rotor core durable enough to withstand repeated use and a rotor formed using this fastening resin composition of rotor. PROBLEM SOLUTIONS
[00022] The present inventors have considered the improvements in modulus and strength of elastic, etc. of a clamping member in order to suppress misalignment and deformation of a magnet even if a centrifugal force acts on a magnet, and studied the use of a clamping resin composition containing inorganic filler mass for a clamping member.
[00023] However, the misalignment and deformation of a magnet could not be suppressed just by improving the elastic modulus and strength, etc. of a clamping member using the aforementioned structures.
[00024] The present inventors intensively conducted the studies in relation to the design guide that realizes the aforementioned structure. In the result, they found that the criterion of elongation of tension at break of the clamping member at a given temperature, which they invented, is useful for the design guide and the present invention has been completed.
[00025] The present invention provides a resin composition for rotor fixation that includes:
[00026] a thermosetting resin containing epoxy resin;
[00027] a healing agent; and
[00028] an inorganic filler mass, in which
[00029] an a-break stress elongation is 0.1% or greater and 1.7% or less,
[00030] the a-break stress elongation is obtained by subjecting a test piece to a tensile test in accordance with JIS K7162 under conditions of a temperature of 120 °C, a test load of 20 MPa and 100 hours and
[00031] The test piece is a cured product produced by subjecting the rotor fastening resin composition to cure by heating at 175°C for 4 hours and molding into a dumbbell shape in accordance with JIS K7162,
[00032] the rotor fastening resin composition is used to form a fastening member, and
[00033] the rotor includes a fixed rotor core and is installed on a rotating shaft in which a plurality of orifice portions are provided along the peripheral portion of the rotating shaft, a magnet is inserted into the orifice portions and the orifice member. Fixing is provided in a separation portion between the orifice portion and the magnet.
[00034] In addition, the present invention provides a rotor that includes:
[00035] a rotor core fixed and installed on a rotating shaft in which a plurality of orifice portions are provided along the peripheral portion of the rotating shaft;
[00036] a magnet inserted into the orifice portions; and
[00037] a fastening member provided in a separation portion between the orifice portion and the magnet, wherein
[00038] The fastening member is formed using the resin composition for rotor fastening mentioned above.
[00039] In addition, the present invention provides an automobile that is manufactured using the aforementioned rotor. ADVANTAGEOUS EFFECTS OF THE INVENTION
[00040] According to the present invention, the elongation of tensile strength at a given temperature is used as the criterion to measure the durability of the rotor core. By using the clamping member in which the a-break stress elongation is 0.1% or greater and 1.7% or less at a temperature of 120 °C, it is possible to achieve a rotor core that exhibits Sufficient durability under high-speed rotation environment at high temperature for a long time. BRIEF DESCRIPTION OF THE DRAWINGS
[00041] The aforementioned objectives and other objectives, features and other advantages become more apparent with reference to the suitable modalities as described below and the attached drawings below.
[00042] Figure 1 is a plan view showing the rotor according to the present embodiment.
[00043] Figure 2 is a cross-sectional view showing the rotor illustrated in Figure 1.
[00044] Figure 3 is an enlarged cross-sectional view showing the rotor illustrated in Figure 1.
[00045] Figure 4 is a plan view showing that the first modified example of the rotor core constitutes the rotor illustrated in Figure 1.
[00046] Figure 5 is a plan view showing that the second modified example of the rotor core constitutes the rotor illustrated in Figure 1.
[00047] Figure 6 is a plan view showing that the third modified example of the rotor core constitutes the rotor illustrated in Figure 1.
[00048] Figure 7 is an enlarged plan view showing a portion of the rotor illustrated in Figure 1.
[00049] Figure 8 is a cross-sectional view showing the rotor illustrated in Figure 1.
[00050] Figure 9 is an enlarged plan view showing a part of the rotor illustrated in Figure 1.
[00051] Figure 10 is a cross-sectional view of the upper mold of the insert molding device used in insert molding. DESCRIPTION OF MODALITIES
[00052] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all drawings, the same reference numerals are attached to the same components and an explanation of the same should not be repeated as appropriate.
[00053] Figure 1 is a plan view showing the rotor 100 according to the present embodiment. Figure 2 is a cross-sectional view showing the rotor 100 illustrated in Figure 1. Figure 1 and Figure 2 are schematic diagrams illustrating the rotor 100, the configuration of the rotor 100 according to the present embodiment is not limited to the same ones shown in Figure 1 and Figure 2.
[00054] The rotor 100 includes the rotor core 110, the magnet 120 and the fastening member 130. In the rotor core 110, the orifice portion 150 is formed. Magnet 120 is inserted into hole portion 150. Attachment member 130 is provided at separation portion 140 between hole portion 150 and magnet 120.
[00055] The fastening member 130 is formed using the fastening resin composition. Resin composition for impeller fixing in accordance with the present embodiment includes thermosetting resin (A), curing agent (B) and inorganic filler mass (C).
[00056] In the present embodiment, the rotor fastening resin composition is cured by heating at 175 °C for 4 hours and the cured product is molded into a dumbbell shape in accordance with JIS K7162. The results obtained using this molded cured product as a test piece will be described as the example. The same shape as the dumbbell shape described in JIS K7162 is described in ISO527-2.
[00057] Hereafter, the tensile elongation at break of a test piece, which is obtained when a tensile test is performed under the conditions of a temperature of 120 oC, a test load of 20 MPa and 100 hours, is called a-break stress elongation. In addition, the tensile elongation at break of a test piece, which is obtained when a tensile test is carried out under the conditions of a temperature of 25 oC, a test load of 20 MPa and 100 hours, is called elongation of breaking tension-b.
[00058] The tensile elongation at break is the value that can be obtained by the following equation where X0 mm represents the entire length of the cured product molded into a dumbbell shape using the resin composition for rotor fixation before a tensile test and X1 mm represents the total length of the same after a tensile test.
[00059] Stress elongation at break = {(X1 mm - X0 mm) / Xo mm} x 100
[00060] The smaller this elongation of tensile strength, the more excellence in deformation resistance and positional stability the obtained rotor core will have even when a load is placed on it.
[00061] The strain-a-break elongation at 120 oC of the resin composition for rotor fastening according to the present embodiment is 0.1% or greater and 1.7% or less. By using the rotor fastening resin composition which has the tensile elongation at break-a within the aforementioned range, it is possible for a rotor core excellent in durability in terms of positional stability. Furthermore, the a-break stress elongation at 120°C is preferably 1.3% or less, more preferably 1.2% or less, and most preferably 1% or less. When the strain-a-break elongation at 120°C is within the aforementioned range, it is possible to achieve a rotor core that exhibits durability under a high-speed rotating environment at a high temperature for a long time. The lower limit of a-break stress elongation is not particularly limited and about 0.1% is sufficient.
[00062] The stress elongation at b-break at 25 oC is preferably 0.1% or greater and 0.5% or less. When the strain-break elongation-b at 25°C, which is measured at a temperature lower than the strain-break elongation-a at 120°C, is within the aforementioned range, it is possible to obtain a rotor core excellent in durability that it has satisfactory resistance to temperature variation and positional stability. Furthermore, the stress elongation at break b at 25°C is more preferably 0.4% or less and most preferably 0.35% or less. When the b-break stress elongation is within the aforementioned range, the durability during high speed rotation is further improved. In the same way as the strain-at-break elongation at 120°C, the lower limit of the strain-at-break elongation-b at 25°C is not particularly limited and about 0.1% is sufficient.
[00063] In order to improve the a-break stress elongation at 120oC and the b-break stress elongation at 25oC, the following methods are effective.
[00064] Firstly, it is necessary to optimize the combination of an epoxy resin and a curing agent for it to thereby improve the creep property of the resin component. In addition to this optimization, it is effective to modify the surface of the inorganic fillers using silane coupling agents to thereby provide the interfacial bond strength between the resin and the inorganic fillers. Furthermore, it is effective to improve the stress transfer efficiency between the resin and the inorganic fillers in order to improve the creep property of the resin itself. Furthermore, it is also effective to adjust the particle diameter distribution of the inorganic fillers to thereby achieve the structure in which microcrack generated within a resin-cured product hardly develops.
[00065] In order to calculate the elastic modulus, a curve (stress-by-tension curve), which is plotted from the relationship between the vertical stress and the vertical stress, is made when the tensile test is performed. The elastic modulus can be obtained from a slope of a straight line in a linear region immediately after starting the tensile test on the tension-by-tension curve. This elastic modulus is one of the barometers that indicate the possibility of deformation of a rotor core. The greater the elastic modulus, the more difficult a obtained rotor core will be deformed and the more excellent the durability will be.
[00066] In the rotor core according to the present embodiment, the elastic-a modulus at 120oC is preferably 0.8x104 MPa or greater. In addition, the elastic-b modulus at 25°C is preferably 1.4x104 MPa or greater. When these elastic modules are within these ranges, durability during high speed rotation is further improved.
[00067] In the present document, the elastic modulus can be adjusted appropriately by the amount of the inorganic filler mass or the selection of the resin component.
[00068] As described above, the cured product of the resin composition for impeller fixing according to the present embodiment has the specific a-break strain elongation. In this way it is possible to obtain a rotor core that is excellent in durability in terms of positional stability. Furthermore, in the cured product of the resin composition for rotor fixing according to the present embodiment, the elastic modulus is preferably set as the specific value. By doing this, it is possible to obtain a rotor core that has a satisfactory balance between deformation resistance and temperature-dependent mechanical strength in addition to positional stability.
[00069] Furthermore, in the rotor core according to the present embodiment, the resin composition for rotor fixing can be produced without using wax. It is usually imperative that wax be added to a semiconductor sealing material in order to prevent a mold from being polluted. Meanwhile, in the resin composition for rotor fixing according to the present embodiment, wax is purposely not included.
[00070] It was found that transfer molding could be performed without polluting a mold by refining the rotor fastening resin composition to include a specific composition. Furthermore, it was found that the elongation of stress at break was decreased compared to the prior art. This reason is not clear enough, but it can be considered that this is due to the improvement in the interfacial strength between the inorganic filler mass and the resin.
[00071] In order to obtain the resin composition for rotor fixation according to the present modality, for example, it is important to properly adjust the respective 3 conditions as described below.
[00072] (1) The property of the inorganic filler mass
[00073] (2) The condition of the silane coupling treatment for the inorganic fill mass
[00074] (3) The combination of thermosetting resin, the curing agent for it and additives.
[00075] Details will be described in the examples.
[00076] However, the production method of the resin composition for rotor fixing according to the present modality is not limited to the aforementioned production method and the resin composition for rotor fixing according to the present modality can be obtained appropriately adjusting the respective conditions. For example, without using silica particles, the resin composition for rotor fixing according to the present embodiment can be obtained by adjusting the treatment condition of the coupling agent.
[00077] The resin composition for fixing the rotor according to the present modality can be used in the aspect described below.
[00078] The rotor 100 according to the present modality constitutes an engine mounted in an automobile, etc., for example. A motor includes rotor 100 and a stator provided around rotor 100 (not shown). A stator is comprised of a stator core and a coil wound around a stator core.
[00079] As shown in Figure 2, the rotor 100 is attached to the rotating shaft 170. The rotation generated by the rotor 100 is transferred to the outside through the rotating shaft 170.
[00080] In the rotor core 110, the through hole for inserting the swivel shaft 170 is provided. The rotor core 110 is fixed to the swivel shaft 170 inserted in the through hole. The shape of the rotor core 110 is not particularly limited, but it can be, for example, circular or polygonal, etc. from a flat view.
[00081] As shown in Figure 2, the rotor core 110 is obtained by rolling the various electromagnetic steel sheets 112 which are thin magnetic bodies in sheet form. Electromagnetic steel sheet 112 is formed of iron or iron alloys, etc., for example.
[00082] Furthermore, as shown in Figure 2, the end plate 118a and the end plate 118b are provided at both ends in the direction of the axis of the rotor core 110. In other words, the end plate 118a is provided on top of the laminated electromagnetic steel sheets 112. In addition, the end plate 118b is provided below the bottom of the laminated electromagnetic steel sheets 112. The end plate 118a and the end plate 118b are fixed to the pivot axis 170 through welding and so on, for example.
[00083] Figure 3 is an enlarged cross-sectional view showing the rotor 100 illustrated in Figure 1. As shown in Figure 3, a slotted portion 160 is formed in the various electromagnetic steel sheets 112. The slotted portion 160 is comprised of bulge formed in the electromagnetic steel sheets 112. The respective electromagnetic steel sheets 112 are connected to each other by means of the recessed portion 160.
[00084] In addition, grooves 116 are formed in the end plate 118a in order to prevent interference from the recessed portion 160 that protrudes from the electromagnetic steel sheets 112 and the fastening member 130 which protrudes from the electromagnetic steel sheets 112. fastening member 130 protruding on the electromagnetic steel sheets 112 is the portion formed by curing the fastening resin composition that remains on the electromagnetic steel sheets 112 when the fastening resin composition is injected into the separating portion 140.
[00085] As shown in Figure 1, the various orifice portions 150 are formed in the rotor core 110. The various orifice portions 150 are arranged in the rotor core 110 so as to build point symmetry around the center of the axis of the swivel shaft 170.
[00086] As shown in Figure 1, in the rotor 100 of the present embodiment, for example, the various groups of orifice portions provided with two adjacent orifice portions 150 are arranged along the periphery of the pivot axis 170. Two orifice portions 150 that constitute a group of orifice portions are arranged in a V-shape from the plan view, for example. In that case, two orifice portions 150 constituting a group of orifice portions are arranged so that respective end portions which are facing each other are positioned towards the side of the pivot axis 170, for example. Furthermore, two orifice portions 150 constituting a group of orifice portions are arranged separate from each other, for example.
[00087] Figure 4 is a plan view showing that the first modified example of the rotor core 110 constitutes the rotor 100 illustrated in Figure 1. As shown in Figure 4, the various groups of orifice portions comprised of three orifice portions 150 can be arranged along the periphery of the pivot axis 170. In that case, three orifice portions 150 are comprised of the orifice portion 154a and the orifice portion 154b, which are arranged in a V-shape from the plan view, and of the orifice portion 156 positioned between these orifice portions. Orifice portion 154a, orifice portion 154b and orifice portion 156 are disposed separate from each other.
[00088] Figure 5 is a plan view showing that the second modified example of the rotor core 110 constitutes the rotor 100 illustrated in Figure 1. As shown in Figure 5, the various orifice portions 150 that are V-shaped a from the plan view can be arranged along the periphery of the swivel axis 170. In that case, the center portion of the orifice portion 150 is positioned on the side of the swivel axis 170 and both end portions of the orifice portions 150 are positioned on the outer side of the periphery of the rotor core 110.
[00089] Figure 6 is a plan view showing that the third modified example of the rotor core 110 constitutes the rotor 100 illustrated in Figure 1. As shown in Figure 6, the various orifice portions 150 that have a rectangular shape perpendicular to the diameter direction of the rotor core 110 from the plan view can be arranged along the periphery of the pivot axis 170.
[00090] In the present document, the arrangement and plan of the orifice portions 150 are not limited to what has been mentioned above.
[00091] Figure 7 is an enlarged plan view showing a portion of the rotor 100 illustrated in Figure 1.
[00092] As shown in Figure 7, the orifice portion 150 has a rectangular shape from a plan view, for example. The orifice portion 150 includes the sidewall 151 positioned on the outside of the periphery of the rotor core 110, the sidewall 153 positioned on the inside of the periphery of the rotor core 110, and the sidewall 155 and sidewall 157 that are facing towards each other in the circumferential direction of the rotor core 110. The side wall 151 and the side wall 153 face each other in the direction of the diameter of the rotor core 110. In the present embodiment, in two orifice portions 150 that constitute a group of orifice portions and are adjacent to each other, the respective side walls 155 are arranged facing each other.
[00093] In the present document, the shape of the orifice portion 150 is not particularly limited as long as it matches the shape of the magnet 120 and can have an elliptical shape, etc., for example.
[00094] As shown in Figure 7, magnet 120 has a rectangular shape from a plan view, for example. Magnet 120 includes sidewall 121 facing sidewall 151, sidewall 123 facing sidewall 153, sidewall 125 facing sidewall 155, and sidewall 127 facing sidewall 157. words, sidewall 121 is positioned on the outside of the periphery of rotor core 110. In addition, sidewall 123 is positioned on the inside of the periphery of rotor core 110. Magnet 120 is a permanent magnet such as a magnet of neodymium. In the present document, the shape of the magnet 120 is not limited to what has been mentioned above and may have an elliptical shape, etc., for example.
[00095] The fixation portion 130 is formed by curing the fixation resin composition with which the gap (hereinafter called the separation portion 140) between the orifice portion 150 and the magnet 120 is filled. For that reason, the magnet 120 is fixed to the rotor core 110. In the rotor 100 according to the present embodiment, the width of the separating portion 140 is 20 µm or more and 500 µm or less, for example.
[00096] The fastening member 130 is provided in the separating portion 140 between the orifice portion 150 and the magnet 120 at least in the direction of the diameter of the rotor core 110. In other words, the fastening member 130 is provided both in the the gap between the sidewall 121 and the sidewall 151 and the gap between the sidewall 123 and the sidewall 153.
[00097] Furthermore, the clamping member 130 is provided so as to cover at least 3 sides of the magnet 120 which has a rectangular shape from the plan view, for example. In other words, at least 3 sides of the sidewall 121, the sidewall 123, the sidewall 125 and the sidewall 127 are covered with the fastening member 130.
[00098] As shown in Figure 7, the separating portions 140 are formed in the gap between the side wall 121 and the side wall 151, in the gap between the side wall 123 and the side wall 153, in the gap between the side wall 125 and the sidewall 155 and in the gap between the sidewall 127 and the sidewall 157, for example. In that case, the sidewall 121, the sidewall 123, the sidewall 125 and the sidewall 127 of the magnet 120 are covered with the fastening member 130.
[00099] In the present embodiment, the fastening members 130 are formed in the span between the sidewall 121 and the sidewall 151 and in the span between the sidewall 123 and the sidewall 153. For this reason, the position of the magnet 120 is fixed in the direction of the diameter of the rotor core 110. Therefore, it is possible to prevent the magnet 120 from being misaligned by a centrifugal force acting during the high speed rotation of a motor.
[000100] Furthermore, as shown in Figure 2, the clamping member 130 is formed so as to cover the upper surface of the magnet 120, for example. For this reason, the position of the magnet 120 is fixed in the direction of the axis of the rotor core 110. Therefore, it is possible to prevent the position of the magnet 120 from being misaligned in the direction of the axis of the rotor core 110 during driving a motor .
[000101] Figure 8 is a cross-sectional view showing the rotor 100 illustrated in Figure 1 and shows the different example of Figure 2.
[000102] As shown in Figure 8, the magnet 120 can be fixed so that the sidewall 121 makes contact with the sidewall 151, for example. In that case, the separating portions 140 are formed in the span between the sidewall 123 and the sidewall 153, in the span between the sidewall 125 and the sidewall 155 and in the span between the sidewall 127 and the sidewall 157. Thereby, the side wall 123, the side wall 125 and the side wall 127 of the magnet 120 are covered with the fastening member 130. Even in this case, the position of the magnet 120 can be fixed in the direction of the diameter of the rotor core 110 .
[000103] In addition, the magnet 120 can be fixed so that the sidewall 123 makes contact with the sidewall 153, for example. In that case, the separating portions 140 are formed in the span between the sidewall 121 and the sidewall 151, in the span between the sidewall 125 and the sidewall 155, and in the span between the sidewall 127 and the sidewall 157. Thus, the side wall 121, the side wall 125 and the side wall 127 of the magnet 120 are covered with the fixing member 130. Even in that case, the position of the magnet 120 can be fixed in the direction of the diameter of the rotor core 110.
[000104] Figure 9 is an enlarged plan view showing a part of the rotor 100 illustrated in Figure 1 and shows the example different from Figure 7. As shown in Figure 9, in the rotor 100 according to the present embodiment, the slots 152 can be provided at both end portions of orifice portion 150. Slots 152 are positioned at both ends of orifice portion 150 in the circumferential direction of rotor core 110. Furthermore, slots 152 are provided so as to be communicated with the orifice portion 150.
[000105] By providing the slots 152 at both ends of the orifice portion 150, it is possible to narrow the magnetic path of the magnetic flux generated from the magnet 120. In other words, it is possible to prevent the magnetic flux, which is generated from both ends of magnet 120 in the direction of the circumferential direction of rotor core 110, short circuit rotor core 110. For this reason, it is possible to reduce a short circuit at rotor core 110 and increase the amount of magnetic flux passing through a stator.
[000106] As shown in Figure 9, the slit filling resin member 132 is formed in the slits 152. The slit filling resin member 132 is formed by curing the fixing resin composition with which the slit side inside the separating portion 140 and the slits 152 are filled, for example. In other words, slit filling resin member 132 is formed by the same process as clamping member 130. Thereby, slit filling resin member 132 is formed as a unit with clamping member 130.
[000107] When the slit 152 is formed, the corner portions are formed at the boundary portions between the side wall 155 and the slit 152 and the boundary portion between the side wall 157 and the slit 152. acts on magnet 120 during the drive of a motor is concentrated in the portions that make contact with the aforementioned corner portions.
[000108] According to the present modified example, forming the slit filling resin member 132 in the slits 152, it is possible to relax the concentration of the voltage acting on the magnet 120 during the drive of a motor. For this reason, it is possible to prevent a large voltage from acting on magnet 120 when starting a motor. Therefore, it is possible to prevent the decomposition of magnet 120 from occurring.
[000109] (Resin Composition for Rotor Fixation)
[000110] Next, the fixing resin composition according to the present embodiment will be described in detail.
[000111] The fixing resin composition according to the present embodiment is in a certain form such as a powder form, a granule form or a tablet form. Thereby, as described below, the fixation resin composition is loaded into the separating portion 140 by the method such as injection of the molten fixation resin composition into the separating portion 140.
[000112] The fixing resin composition according to the present embodiment includes a thermosetting resin (A), a curing agent (B) and an inorganic filler mass (C).
[000113] Thermoset Resin (A)
[000114] The thermosetting resin (A) is not particularly limited, but an epoxy resin (A1), a phenolic resin, an oxetane resin, a (meth)acrylate resin, an unsaturated polyester resin, a phthalate resin. diallyl, a maleimide resin or the like is used. Among these, epoxy resin (A1) is used in a suitable way in that it has excellent curability and storage capacity and a cured product thereof has excellent heat resistance, moisture resistance and chemical resistance.
[000115] The thermosetting resin (A) according to the present preferred embodiment includes an epoxy resin (A1). The weight or molecular structure of the epoxy resin (A1) is not particularly limited.
[000116] The epoxy resin (A1) is not particularly limited and examples thereof include epoxy resins based on novolac such as an epoxy resin based on phenol novolac and an epoxy resin based on cresol novolac; bisphenol based epoxy resins such as a bisphenol A based epoxy resin and a bisphenol F based epoxy resin; epoxy resins based on aromatic glycidylamine such as N,N-diglycidyllaniline, N,N-diglycidyltoluidine, glycidylamine based on diaminodiphenylmethane and glycidylmania based on aminophenol; a hydroquinone based epoxy resin; biphenyl based epoxy resin; a stilbene-based epoxy resin; an epoxy resin based on triphenolmethane; an epoxy resin based on triphenolpropane; an alkyl-modified triphenolpropane-based epoxy resin; an epoxy resin containing a triazine core; a dicyclopentadiene-modified phenol-based epoxy resin; a naphthol-based epoxy resin; a naphthalene-based epoxy resin; a naphthalene ether-based epoxy resin; aralkyl based epoxy resins such as a phenolaralkyl based epoxy resin containing phenylene structure and/or biphenylene structure and a naphtholaralkyl based epoxy resin containing phenylene structure and/or biphenylene structure; and alicyclic epoxy aliphatic epoxy resins such as vinylcyclohexene dioxide, dicyclopentadiene oxide or alicyclic diepoxy adipate. These can be used singly or in combination of 2 or more types of them.
[000117] When the thermosetting resin (A) includes the epoxy resin (A1), it is preferable that the epoxy resin (A1) contains the structure in which the aromatic ring is coupled with the glycidyl ether structure or the glycidylamine structure in terms of heat resistance, mechanical properties and moisture resistance. Particularly preferred examples of the epoxy resin (A1) include the epoxy resin containing the structure represented by the following general formula (II) (wherein c represents an integer from 1 to 20 and d represents an integer from 0 to 20). Chemical Formula 1

[000118] In addition, examples of the phenolic resin include a resol-based phenolic resin and novolac-based phenolic resins such as a phenol novolac resin, a cresol novolac resin and a bisphenol novolac resin THE.
[000119] The amount of thermosetting resin (A) according to the present embodiment is not particularly limited, but is preferably equal to or more than 5% by mass and equal to or less than 40% by mass and more preferably equal to or greater than 10% by mass and equal to or less than 20% by mass, based on 100% by mass of the total amount of the bonding resin composition.
[000120] In a preferred embodiment that includes the epoxy resin (A1) and the thermosetting resin (A), the amount of the epoxy resin is not particularly limited, but is preferably equal to or more than 70% by mass and equal to or less than 100% by mass and more preferably equal to or more than 80% by mass and equal to or less than 100% by mass based on 100% by mass of the thermosetting resin (A).
[000121] Healing Agent (B)
[000122] The curing agent (B) is used to three-dimensionally crosslink the epoxy resin (A1) which is preferably included in the thermosetting resin (A). Curing agent (B) is not particularly limited, but phenolic resin can preferably be used, for example. This phenolic resin-based curing agent is the full range of monomer, oligomer and polymer that contains at least two phenolic hydroxide groups within a molecule and the molecular weight and molecular structure of the same are not particularly limited.
[000123] Examples of the phenolic resin based curing agent include novolac based resins such as a phenol novolac resin, a cresol novolac resin and a naphthol novolac resin; a polyfunctional phenolic resin such as a phenolic resin based on trifluoromethane; modified phenolic resins such as a terpene-modified phenolic resin and dicyclopentadiene-modified phenolic resin; aralkyl based resins such as a phenolaralkyl resin which contains phenylene structure and/or biphenylene structure and naphtholaralkyl resin which contains phenylene structure and biphenylene structure; a phenolic resin formed by reacting hydroxybenzaldehyde, formaldehyde and phenol; bisphenol compounds such as bisphenol A and bisphenol F; and a metal naphthenate such as cobalt naphthenate. These can be used singly or in combination of 2 or more types of them. The use of the aforementioned phenolic resin based curing agent achieves the satisfactory balance of flame resistance, moisture resistance, electrical properties, curing properties, storage stability and the like. In particular, in terms of curing properties, the equivalents of the hydroxyl groups in the phenolic resin-based curing agent can be established as, for example, equal to or less than 90 g/eq and equal to or less than 250 g/ eq.
[000124] Additionally, examples of other curing agents that can be additionally used include a polyaddition based curing agent, a catalyst based curing agent and a condensation based curing agent.
[000125] Examples of the polyaddition-based curing agent include polyamino compounds which include aliphatic polyaminos such as diethylenetriamine (DETA), triedylenetetramino (TETA) and metaxylenediamino (MXDA), aromatic polyaminos such as diaminodiphenylmethane (DDM), m- phenylenediamine (MPDA) and diaminodiphenylsulfone (DDS), as well as dicyandiamido (DICY) and organic acid dihydrazide; acid anhydrides which include alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA) and benzophenonetetracarboxylic acid (BTDA); polyphenol compounds such as a novolac-based phenolic resin and a phenolic polymer; polymercaptan compounds such as a polysulfide, a thioester and a thioether; isocyanate compounds such as an isocyanate prepolymer and a blocked isocyanate; and organic acids such as a polyester resin which contains carboxylic acid.
[000126] Examples of the catalyst based curing agent include tertiary amino compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); imidazole compounds such as 2-methylimidazole and 2-ethyl-4-methylimidazole (EMI24); and a Lewis acid such as a BF3 complex.
[000127] Examples of the condensation-based curing agent include a resole resin; a urea resin such as a methylol group-containing urea resin; a melanin resin such as a melanin resin which contains methylol group.
[000128] In the present invention, it is preferred that the curing agent includes at least one selected from the group consisting of a phenolic resin based on novolac, a phenolaralkyl resin, a phenolic resin based on naphthol, and a formed phenolic resin reacting hydroxybenzaldehyde, formaldehyde and phenol.
[000129] When these other curing agents are additionally used, the amount of curing agent based on phenolic resin is preferably equal to or more than 20% by mass, more preferably equal to or more than 30% by weight mass and particularly preferably equal to or more than 50% by mass, based on the whole curing agent (B). When the blend ratio is within the above range, satisfactory fluidity can be exhibited while maintaining flame resistance. Furthermore, the amount of the phenolic resin-based curing agent is not particularly limited to, but is preferably equal to or less than 100% by mass, based on the whole curing agent (B).
[000130] The amount of the curing agent (B) in the fixing resin composition is not particularly limited, but is preferably equal to or less than 0.8% by mass and more preferably equal to or more than 1.5% by weight. mass, based on 100% by mass of the total amount of the bonding resin composition. Good curing properties can be obtained by setting the blend ratio within the above range. Additionally, the amount of curing agent (B) in the fixing resin composition is also not particularly limited, but is preferably equal to or less than 12% by mass and more preferably equal to or less than 10% by mass, based by 100% by mass of the total amount of the fixing resin composition.
[000131] In addition, it is preferred that the phenolic resin as the curing agent (B) and the epoxy resin (A1) as the thermosetting resin (A) are mixed, so that the equivalent ratio (EP)/(OH) from the number of epoxy groups (EP) in the total thermosetting resin (A) to the number of phenolic hydroxyl (OH) groups in the entire phenolic resin is equal to or more than 0.8 and equal to or less than 1.3, preferably equal to or more than 1 and equal to or less than 1.2 and more preferably equal to or more than 1.1 and equal to or less than 1.2. When the equivalent ratio is within the above range, sufficient curing properties can be obtained during molding of the obtained setting resin composition. When a resin other than a phenolic resin that can react with an epoxy resin is additionally used, the equivalent proportion thereof can be adjusted accordingly.
[000132] Inorganic Filling Mass (C)
[000133] As the inorganic filler mass (C), an inorganic filler mass which is generally used in the technical field of fixing resin compositions can be used.
[000134] Examples of the inorganic filler mass (C) include silica such as crushed fused silica or fused spherical silica, crystalline silica, alumina, kaolin, talc, clay, mica, rock wool, wollastonite, glass powder, glass flakes , glass beads, glass fibers, silicon carbide, silicon nitride, aluminum nitride, carbon black, graphite, titanium dioxide, calcium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate , cellulose, aramid, wood and the pulverized powder obtained by spraying the cured products of phenolic resin molding materials or epoxy resin molding materials. Among them, silica such as crushed fused silica, fused spherical silica or crystalline silica is preferable and fused spherical silica is more preferable. Additionally, among them, calcium carbonate is preferred in terms of cost. The inorganic filler mass (C) can be used alone or in combination of two or more types thereof.
[000135] The median particle diameter D50 of the inorganic filler mass (C) is preferably equal to or more than 0.01 μm and equal to or less than 75 μm and more preferably equal to or more than 0.05 μm and equal at or less than 50 µm. The filling properties in the separation portion 140 between the orifice portion 150 and the magnet 120 are improved by setting the median particle diameter of the inorganic fill mass (C) within the above range. The median particle diameter D50 is defined as a median particle diameter of volume conversion by a RODOS SR type laser diffraction measuring device (SYMPATEC HEROS&RODOS).
[000136] Furthermore, in the fixing resin composition according to the present embodiment, the inorganic filler mass (C) may contain 2 or more types of spherical silica having different median particle diameters D50. Using this type of inorganic filling mass (C), it is possible to simultaneously achieve both burr suppression and improvement in fluidity and filling properties.
[000137] The amount of the inorganic filler mass (C) is preferably equal to or more than 50% by mass, more preferably equal to or more than 60% by mass, even more preferably equal to or more than 65% in mass and particularly preferably equal to or greater than 75% by mass, based on 100% by mass of the total amount of the fixing resin composition. When the amount of inorganic filler mass (C) is within the above range, it is possible to reduce both an increase in moisture absorption and a decrease in strength which are accompanied by curing the obtained fixing resin composition. Additionally, the amount of the inorganic filler mass (C) is preferably equal to or less than 93% by mass, more preferably equal to or less than 91% by mass and even more preferably equal to or less than 90% by mass. , based on 100% by mass of the total amount of the fixing resin composition. When the amount of inorganic filler mass (C) is within the above range, the obtained setting resin composition has satisfactory fluidity as well as satisfactory moldability. Therefore, the manufacturing stability of the rotor is increased and a rotor that has the excellent balance between production and durability is obtained.
[000138] Furthermore, the results of the studies conducted by the present inventors revealed that the difference in coefficient of linear expansion between the fastening member 130 and the electromagnetic steel plate 112 can be reduced by establishing the amount of inorganic filler mass (C ) to equal to or less than 50% by mass. Using this type of bonding resin composition, it is possible to prevent the deformation of the electromagnetic steel sheet 112 depending on the temperature change and deterioration of the rotational properties of the rotor 100. As a result, it is possible to achieve a rotor that it has excellent continuity of rotation properties within durability.
[000139] Furthermore, in the case where silica such as fused crushed silica, fused spherical silica and crystalline silica is used as the inorganic filler mass (C), the amount of silica is preferably equal to or less than 40% by mass and more preferably equal to or less than 60% by mass, based on 100% by mass of the total amount of the fixing resin composition. When the amount of silica is within the above range, the balance between fluidity and thermal expansion coefficient becomes satisfactory.
[000140] Furthermore, in the case where the inorganic filler mass (C) is used in combination with a metal hydroxide such as aluminum hydroxide or magnesium hydroxide, or an inorganic flame retardant such as zinc borate, zinc molybdate or antimony trioxide, which are described below, the total amount of the inorganic flame retardant and the inorganic fill mass is preferably within the aforementioned range of the amount of the inorganic fill mass (C).
[000141] The inorganic filler mass (C) can be preliminarily subjected to surface treatment with the use of coupling agent (F) (may be called first coupling agent) such as a silane coupling agent. By carrying out the surface treatment, it is possible to avoid aggregation of the inorganic fillers and to achieve a satisfactory fluidity. As a result, it is possible to improve the filling properties of the fixing resin composition in the separating portion 140.
[000142] In addition, because the surface treatment enhances the affinity of the inorganic filler mass (C) with the resin component, it is possible to improve the strength of the formed fastening member using the fastening resin composition .
[000143] Examples of the first coupling agent used in surface treatment for inorganic filler mass (C) include primary aminosilanes such as y-aminopropyltriethoxysilane and y-aminopropyltrimethoxysilane. When the type of the first coupling agent used in the surface treatment for the inorganic filler mass (C) is selected from appropriately or the combination amount of the first coupling is appropriately adjusted, it is possible to control the fluidity of the resin composition. clamping force, the strength of the clamping member and the like.
[000144] The first coupling treatment for the inorganic filler mass (C) can be carried out as follows, for example. First, the inorganic fillers (C) and the silane coupling agents are mixed and stirred by a mixer. Like a mixer, a ribbon beater, etc. can be used. During mixing and stirring, the moisture in a blender is preferably set to 50% or less. By preparing this type of spray environment, it can be suppressed that moisture reattaches to the surface of the silica particles. Furthermore, it can be suppressed that the coupling agents to be sprayed are contaminated by moisture, which results in the reaction between the coupling agents.
[000145] Then, a mixture obtained is removed from the mixer and is subjected to aging, a treatment to thus facilitate the coupling reaction. An aging treatment is carried out under the condition of 20±5 oC for 7 days or more. By carrying out the aging treatment under this type of condition, it is possible to uniformly couple the coupling agent to the surface of the silica particle. Then, the mixture is sieved to remove the coarse particles in this way. Through the treatment mentioned above, the inorganic filler mass (C) subjected to the silane coupling treatment can be obtained.
[000146] Using this type of surface treated silica particles, it is possible to improve the interfacial adhesion strength between the silica particles and the resin composition. Furthermore, it is possible to avoid the generation of microcracks in the clamping member.
[000147] Other Components
[000148] The fixing resin composition according to the present embodiment may include a cure accelerator (D). The cure accelerator (D) can be any one that promotes the reaction between an epoxy group of the epoxy resin and a hydroxyl group of the phenolic resin-based curing agent (B) and a commonly used cure accelerator (D) can to be used.
[000149] Specific examples of the cure accelerator (D) include phosphorus-containing compounds such as an organic phosphine, a tetra substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound, and a quinone compound and an adduct of a phosphonium compound and a silane compound; and nitrogen atom containing compounds represented by amidine based compounds such as 1,8-diazabicyclo(5.4,0)undecene-7 and imidazole, tertiary amines such as benzyldimethylamino, amidinium salts which are onium salts quaternaries of the above compounds and ammonia salts.
[000150] Among them, the compounds containing phosphorus atom are preferred from the point of view of curing properties and from the point of view of a balance between fluidity and curing properties, the most preferable curing accelerators are curing accelerators latents such as a tetrasubstituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphonium compound and a silane compound. A tetra substituted phosphonium compound is particularly preferred from a fluidity standpoint and from a weld strength standpoint, particularly preferred cure accelerators are a phosphobetaine compound and an adduct of a phosphine compound and a quinone compound and an adduct of a phosphonium compound and a silane compound is particularly preferred from the standpoint of latent curing properties. In addition, a tetra substituted phosphonium compound is preferred from the standpoint of continuous moldability. In addition, an organic phosphine and a nitrogen-containing compound can be used in a cost-effective way.
[000151] Examples of the organic phosphine that can be used to form the fixing resin composition according to the present embodiment include primary phosphines such as ethylphosphine and phenylphosphine; secondary phosphines such as dimethylphosphine and diphenylphosphine; and tertiary phosphines such as trimethylphosphine, triethylphosphine, tributylphosphine and triphenylphosphine.
[000152] Examples of the tetra substituted phosphonium compound that can be used for the fixing resin composition according to the present embodiment include a compound represented by the following general formula (1).
[000153] Chemical Formula 2

[000154] In the general formula (1), P represents a phosphoric atom; each of R1, R2, R3 and R4 independently represents an aromatic group or an alkyl group; A represents an anion of an aromatic organic acid which contains, in an aromatic ring, at least one functional group selected from a hydroxyl group, a carboxyl group and a thiol group; AH represents an aromatic organic acid which contains, in an aromatic ring, at least one functional group selected from a hydroxyl group, a carboxyl group and a thiol group; x and y respectively represent an integer from 1 to 3; z represents an integer from 0 to 3; and x=y.
[000155] The compound represented by the general formula (1) is obtained, for example, in the following manner, but it is not limited thereto. First, a tetra substituted phosphonium halide, an aromatic organic acid in a base are added to an organic solvent and uniformly mixed to produce an aromatic organic acid anion in the solution system. Subsequently, water is added to the solution so that the compound represented by the general formula (1) can be precipitated.
[000156] In the compound represented by the general formula (1), R1, R2, R3 and R4 bonded to a phosphoric atom each preferably represent a phenyl group, AH preferably represents a compound having a hydroxyl group in its aromatic ring, i.e. , a phenol compound, and A preferably represents an anion of the phenol compound, from the standpoint of an excellent balance between production during synthesis and the healing promoting effect. Additionally, the phenol compound includes, within its concept, monocyclic phenol, cresol, catechol, resorcin, condensed polycyclic naphthol, dihydroxynaphthalene and various aromatic ring containing (polycyclic) compounds such as bisphenol A, bisphenol F, bisphenol S, biphenol, phenylphenol and phenol novolac. Among these, a phenol compound that has 2 hydroxyl groups is preferably used.
[000157] Examples of the phosphobetain compound which can be used for the fixing resin composition according to the present embodiment include a compound represented by the following general formula (2).
[000158] Chemical Formula 3

[000159] In the general formula (2), X1 represents an alkyl group having 1 to 3 carbon atoms; Y1 represents a hydroxyl group; a represents an integer from 0 to 5; and b represents an integer from 0 to 4.
[000160] The compound represented by the general formula (2) is obtained, for example, through a step in which a substituted triaromatic phosphine, i.e. a tertiary phosphine, is brought into contact with a diazonium salt in order to replace a diazonium group of the diazonium salt with the substituted triaromatic phosphine. However, the production method is not limited to this.
[000161] Examples of the adduct of a phosphine compound and a quinone compound that can be used for the fixing resin composition according to the present embodiment include a compound represented by the following general formula (3).
[000162] Chemical Formula 4

[000163] In the general formula (3), P represents a phosphoric atom; R5, R6 and R7 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms; each of R8, R9 and R10 independently represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms; and R8 and R9 can be linked together to form a ring.
[000164] Preferred examples of the phosphine compound, which is used to form the adduct of a phosphine compound and a quinone compound, include triphenylphosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, trinaphthylphosphine and tris(benzyl) )phosphine, each such contains an unsubstituted aromatic ring or an aromatic ring which has a substituent such as an alkyl group or an alkoxy group. Examples of the substituent include an alkyl group and an alkoxy group having 1 to 6 carbon atoms. From the standpoint of easy availability, triphenylphosphine is preferred.
[000165] Additionally, examples of the quinone compound, which is used to form the adduct of a phosphine compound and a quinone compound, include o-benzoquinone, p-benzoquinone and anthraquinones. Among these compounds, p-benzoquinone is preferred from the standpoint of storage stability.
[000166] The adduct of a phosphine compound and a quinone compound can be obtained by putting an organic tertiary phosphine in contact with a benzoquinone in a solvent that can dissolve both the organic tertiary phosphine and the benzoquinone followed by mixing. Suitable examples of the solvent include ketones such as acetone and methyl ethyl ketone where the solubility for the adduct is low. However, the solvent is not limited to these.
[000167] In the compound represented by the general formula (3), R5, R6 and R7, which are attached to a phosphoric atom, each preferably represent a phenyl group and R8, R9 and R10 each preferably represent a hydrogen atom. In other words, a compound produced by adding 1,4-benzoquinone to triphenylphosphine is preferred because the elastic modulus during heating of a cured product of the bonding resin composition is lowered.
[000168] Examples of the adduct of a phosphonium compound and a silane compound, which can be used to form the fixing resin composition according to the present embodiment include a compound represented by the following general formula (4).
[000169] Chemical Formula 5

[000170] In the general formula (4), P represents a phosphoric atom; Si represents a silicon atom; each of R11, R12, R13 and R14 independently represents an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group; X2 represents an organic group that is attached to groups Y2 and Y3; X3 represents an organic group that is attached to groups Y4 and Y5; Y2 and Y3 each independently represent a group formed when a proton donating group releases a proton and the Y2 and Y3 groups on the same molecule are bonded to the silicon atom to form a chelate structure; Y4 and Y5 each independently represent a group formed when a proton donating group releases a proton and the Y4 and Y5 groups on the same molecule are bonded to the silicon atom to form a chelate structure; X2 and X3 can be the same or different from each other; Y2, Y3, Y4 and Y5 can be the same or different from each other; and Z1 represents an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group.
[000171] In the general formula (4), examples of R11, R12, R13 and R14 include a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group, a naphthyl group, a hydroxynaphthyl group, a benzyl group, a group methyl, an ethyl group, an n-butyl group, an n-octyl group and a cyclohexyl group. Among them, aromatic groups having a substituent and unsubstituted aromatic groups such as a phenyl group, a methylphenyl group, a methoxyphenyl group, a hydroxyphenyl group and a hydroxynaphthyl group are preferred.
[000172] Additionally, in the general formula (4), X2 represents an organic group that is bonded to Y2 and Y3. Likewise, X3 represents an organic group that is linked to groups Y4 and Y5. Y2 and Y3 each represent a group formed when a proton donating group releases a proton and the Y2 and Y3 groups on the same molecule are bonded to the silicon atom to form a chelate structure. Likewise, Y4 and Y5 each represent a group formed when a proton donating group releases a proton and the Y4 and Y5 groups on the same molecule are bonded to the silicon atom to form a chelate structure. The X2 and X3 groups can be the same or different from each other and the Y2, Y3, Y4 and Y5 groups can be the same or different from each other. The group represented by -Y2- X2-Y3- and the group represented by -Y4-X3-Y5- in the general formula (4) are each a group formed when a proton donor releases 2 protons. As the proton donor, an organic acid that has at least two carboxyl groups or hydroxyl groups in the molecule is preferred, an aromatic compound that has at least 2 carboxyl groups or hydroxyl groups on carbon constituting the aromatic ring is more preferred and an aromatic compound that has at least 2 hydroxyl groups on adjacent carbons that make up the aromatic ring is even more preferred.
[000173] Examples of the proton donor include catechol, pyrogallol, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,2'-biphenol, 1,1'-bi-2-naphthol, salicylic acid, 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol and glycerin. Of these, catechol, 1,2-dihydroxynaphthalene and 2,3-dihydroxynaphthalene are most preferred from the standpoint of a balance between high availability and starting materials and a healing promoting effect.
[000174] Furthermore, in the general formula (4), Z1 represents an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group. Specific examples thereof include aliphatic hydrocarbon groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group and an octyl group; aromatic hydrocarbon groups such as a phenyl group, a benzyl group, a naphthyl group and a biphenyl group; and reactive substituents such as a glycidyloxypropyl group, a mercaptopropyl group, an aminopropyl group and a vinyl group. Among them, a methyl group, an ethyl group, a phenyl group, a naphthyl group and a biphenyl group are more preferable from the point of view of thermal stability.
[000175] The adduct of a phosphonium compound and a silane compound can be obtained, for example, by the following method. First, a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are added to a flask filled with methanol and then dissolved in it. Subsequently, a methanol solution of sodium methoxide is added dropwise to the flask under stirring at room temperature. Subsequently, a solution which has been preliminary prepared by dissolving a tetrasubstituted phosphonium halide such as tetraphenyl phosphonium bromide in methanol is added dropwise to the flask under stirring at room temperature so that crystals are precipitated. The precipitated crystals are filtered, washed with water and then vacuum dried to obtain an adduct of a phosphonium compound and a silane compound. However, the production method is not limited to this.
[000176] The amount of the cure accelerator (D), which can be used for the resin composition for fixing according to the present modality, is preferably equal to or greater than 0.1% by mass, based on 100% by mass of the total amount of resin composition for fixing. When the amount of cure accelerator (D) is within the above range, sufficient cure properties can be obtained. In addition, the amount of cure accelerator (D) is preferably equal to or less than 3% by mass and more preferably equal to or less than 1% by mass, based on 100% by mass of the total value of the entire composition of fixing resin. When the amount of cure accelerator (D) is within the above range, sufficient flow capacity can be obtained.
[000177] The resin composition for fixation of the present embodiment may additionally include a compound (E) in which hydroxyl groups are attached to the respective 2 or more adjacent carbon atoms that constitute an aromatic ring (hereinafter it may be referred to as the " compound (E)”). With the use of compound (E), it is possible to suppress the reaction of the resin composition for fixing during the melt kneading and to stably obtain the resin composition for fixing even when a cure accelerator that contains a phosphorus atom that does not latency is used as the healing accelerator (D). Furthermore, compound (E) also has an effect of lowering the melt viscosity of the fixing resin composition and increasing the flowability. Examples of the compound (E) include a monocyclic compound represented by the general formula (5) below and a polycyclic compound represented by the general formula (6) below. These compounds may have a substituent other than a hydroxyl group.
[000178] Chemical Formula 6

[000179] In the general formula (5), any one of R15 and R19 represents a hydroxyl group and the other represents a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group; and R16, R17 and R18 each representing a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group.
[000180] Chemical Formula 7

[000181] In the general formula (6), any one of R20 and R26 represents a hydroxyl group and the other represents a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group; and R21, R22, R23, R24 and R25 each represent a hydrogen atom, a hydroxyl group or a substituent other than a hydroxyl group.
[000182] Specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, an ester of gallic acid and a derivative thereof. Furthermore, specific examples of the polycyclic compound represented by the general formula (6) include 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and a derivative thereof. Among the same compounds, from the standpoint of easy control of flowability and curability, a preferable example thereof is a compound in which hydroxyl groups which are respectively attached to 2 adjacent carbon atoms constitute an aromatic ring. Furthermore, from the point of view of volatilization in the kneading step, a more preferred example is a compound that has, as mother cores, a naphthalene ring that has low volatility and high weighing stability. In that case, the compound (E) may be, as a specific example, a compound having a naphthalene ring, such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene or derivatives thereof. These compounds (E) can be used singly or in combination of two or more types thereof.
[000183] The amount of compound (E) is equal to or greater than 0.01% by mass, more preferably equal to or greater than 0.03% by mass and particularly and preferably equal to or greater than 0.05% by mass, based on 100% by mass of the entire bonding resin composition. When the amount of compound (E) is within the above range, sufficient viscosity-lowering and flowability enhancing effects can be obtained for the fixing resin composition. In addition, the amount of compound (E) is equal to or less than 2% by mass, more preferably equal to or less than 0.8% by mass and particularly and preferably equal to or less than 0.5% by mass, based on 100% by mass of the entire bonding resin composition. When the amount of compound (E) is within the above range, there is little risk of deterioration in the curing properties and physical properties of the curable products of the fixing resin composition.
[000184] In the resin composition for fixing according to the present embodiment, a coupling agent (F) (hereinafter may be referred to as the second coupling agent), which is other than the above-mentioned first coupling agent, can be additionally added in order to improve the adhesion between the epoxy resin (A1) and the inorganic filler (C). The second coupling agent is the one that undergoes a reaction between the epoxy resin (A1) and the inorganic filler mass (C) and improves the interfacial strength between the epoxy resin (A1) and the inorganic filler mass (C).
[000185] The second coupling agent is not particularly limited and examples thereof include epoxysilane, aminosilane, ureidosilane and mercaptosilane. Furthermore, when the second coupling agent is used in combination with the aforementioned compound (E), the second coupling agent can enhance the effects of the compound (E) which reduce the melt viscosity of the resin composition for setting and improve the flow capacity of it.
[000186] Examples of the epoxysilane include y-glycidoxypropyltriethoxysilane, y-glycidoxypropyltrimethoxysilane, y-glycidoxypropylmethyldimethoxysilane and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. Furthermore, examples of the aminosilane include y-aminopropyltriethoxysilane, y-aminopropyltrimethoxysilane, N-β(aminoethyl) y-aminopropyltrimethoxysilane, N-β(aminoethyl) y-aminopropylmethyldimethoxysilane, y-aminopropyltriethoxysilane of N-phenyl sylanopropyl N-phenyl, N-β(aminoethyl) y-aminopropyltriethoxysilane, N-6-(aminohexyl)-3-aminopropyltrimethoxysilane and N-(3-(trimethoxysilylpropyl)-1,3-benzenedimethane. y-ureidopropyltriethoxysilane and hexamethyldisilazane A product formed by reacting the primary amino site of aminosilane with ketones or aldehydes can be used as a latent aminosilane coupling agent.In addition, the aminosilane may have a secondary amino group. of the mercaptosilane include y-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane and also silane coupling agents, which exhibit the same function as a mercaptosilane coupling agent until through pyrolysis, such as bis(3-triethoxysilylpropyl)tetrasulfide and bis(3-triethoxysilylpropyl)disulfide. Furthermore, these silane coupling agents can be blended with their hydrolysates that have been preliminary prepared by a hydrolysis reaction. These silane coupling agents can be used singly or in combination of 2 or more types thereof.
[000187] From the point of view of continuous moldability, mercaptosilane is preferred. From a flowability standpoint, aminosilane is preferred. From an adhesion standpoint, epoxysilane is preferred.
[000188] The amount of coupling agent (F) that can be used for the resin composition for fixing according to the present embodiment is preferably equal to or greater than 0.01% by mass, more preferably equal to or greater than 0.05% by mass and particularly preferably equal to or greater than 0.1% by mass, based on 100% by mass of the entire fixing resin composition. When the amount of coupling agent (F) such as a silane coupling agent is within the above range, satisfactory vibration resistance is obtained without decreasing the interfacial strength between the epoxy resin (A1) and the inorganic filler mass ( Ç). Furthermore, the amount of coupling agent (F) such as a silane coupling agent is preferably equal to or less than 1% by mass, more preferably equal to or less than 0.8% by mass and particularly and preferably equal to or less than 0.6% by mass, based on 100% by mass of the entire fixing resin composition. When the amount of coupling agent (F) such as a silane coupling agent is within the above range, satisfactory vibration resistance is obtained without decreasing the interfacial strength between the epoxy resin (A1) and the inorganic filler mass ( Ç). Additionally, when the amount of coupling agent (F) such as a silane coupling agent is within the above range, satisfactory rust resistance is obtained without increasing the water absorption of the cured product of the fixing resin composition.
[000189] An inorganic flame retardant (G) can be added to the resin composition for fixing in accordance with the present embodiment in order to improve flame retardancy. As the inorganic flame retardant (G), a metal hydroxide or a composite metal hydroxide, which can exhibit combustion reaction through dehydration and heat absorption during combustion, is preferred due to the fact that the combustion time can be shortened. Examples of the metal hydroxide include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide and zirconium hydroxide. The composite metal hydroxide can be a hydrotalcite compound that contains 2 or more types of metal elements, in which at least one metal element is magnesium and the other metal elements are selected from calcium, aluminum, tin, titanium , iron, cobalt, nickel, copper and zinc. Among the same composite metal hydroxides, a solid magnesium/zinc hydroxide solution is readily available on the market. Among them, aluminum hydroxide or a solid magnesium/zinc hydroxide solution is preferred from the point of view of continuous moldability. Inorganic flame retardants (G) can be used singly or in combination of 2 or more types thereof. Furthermore, in order to reduce the negative effects on the continuous moldability, it is preferable to conduct a surface treatment using silicon compounds such as a silane coupling agent or aliphatic compounds such as a wax, etc.
[000190] The amount of the inorganic flame retardant (G) according to the present embodiment is preferably small and more preferably equal to or less than 0.2% by mass. Generally, a flame retardant needs to be added to a sealing agent for the semiconductor in order to meet the UL Standard. However, when the amount of a flame retardant is too high, the curing reaction of a thermosetting resin is inhibited and so the strength of the clamping member can be decreased. For this reason, in the present embodiment, it is preferred that the amount of addition of the inorganic flame retardant (G) is as small as possible.
[000191] In the resin composition for fixing according to the present modality, the concentration of ionic impurities is preferably equal to or less than 500 ppm, more preferably equal to or less than 300 ppm and even more preferably equal to or less than 200 ppm, based on the resin composition for fixing. Furthermore, the concentration of the ionic impurities is not particularly limited, but is preferably equal to or greater than 0 ppb, more preferably equal to or greater than 10 ppb, and even more preferably equal to or greater than 100 ppb, based on the composition of resin for fixing according to the present embodiment. By adjusting the ionic impurities within the above ranges, when the cured product of the resin composition for fastening according to the present modality is used to form the fastening member, the high resistance to rust can be maintained even with a treatment under a high temperature and a high humidity.
[000192] The ionic impurities in the present embodiment are not particularly limited, but examples thereof include alkali metal ions, alkaline earth metal ions and halogen ions and more specific examples include sodium ions and chlorine ions. The sodium ion concentration is preferably equal to or less than 100 ppm, more preferably equal to or less than 70 ppm and even more preferably equal to or less than 50 ppm, based on the resin composition for fixing according to the present. modality. In addition, the chlorine ion concentration is preferably equal to or less than 100 ppm, more preferably equal to or less than 50 ppm, and even more preferably equal to or less than 30 ppm, based on the resin fixation composition. according to the present invention. By adjusting the ionic impurities within the above ranges, corrosion of the electromagnetic steel plate or magnet can be inhibited.
[000193] In the present modality, the ionic impurities can be reduced with the use of, for example, an epoxy resin that has high purity. As a result, a rotor that has excellent durability is obtained.
[000194] The concentration of ionic impurities can be determined as follows. First, the resin composition for setting according to the present embodiment is molded and cured at 175°C for 180 seconds and then sprayed by a spraying machine to obtain a powder of a cured product. The powder obtained from the cured product is treated at 120°C for 24 hours in pure water and ions are extracted into pure water. Then, the concentration of ionic impurities can be measured by Inductively Coupled Plasma Mass Spectrometry (ICP-MS).
[000195] In the resin composition for fixing according to the present modality, the amount of alumina is preferably equal to or less than 10% by mass, more preferably equal to or less than 7% by mass and even more preferably equal to or less than than 5% by mass, based on 100% by mass of the total amount of resin composition for fixing. The amount of alumina is not particularly limited, but is preferably, for example, equal to or greater than 0% by mass, more preferably equal to or greater than 0.01% by mass and even more preferably equal to or greater than 0.1% by mass, based on 100% by mass of the total amount of resin composition for fixing in accordance with the present embodiment. By adjusting the amount of alumina to be equal to or less than the upper limit, it is possible to achieve improved flowability and reduction in weight and size of the resin composition for fixing in accordance with the present embodiment. In the present modality, 0% by mass allows a value within a detection limit.
[000196] As the components except the components mentioned above, the resin composition for fixation according to the present modality can be properly blended with ion scavengers, such as hydrotalcites and hydroxides of elements selected from magnesium, aluminum, bismuth, titanium and zirconium; dyes such as carbon black, ferric oxide and titanium oxide; natural waxes such as a carnauba wax; synthetic waxes such as a polyethylene wax; release agents such as paraffin and larger fatty acids and metal salts thereof such as stearic acid and zinc stearate; and low stress agents such as a polybutadiene compound, an acrylonitrile butadiene copolymerization compound and silicone compounds such as silicone oil and silicone rubber; adhesion imparting agents such as thiazoline, diazole, triazole, triazine and pyrimidine.
[000197] The amount of dye in the present embodiment is preferably equal to or greater than 0.01% by mass and equal to or less than 1% by mass and more preferably equal to or greater than 0.05% by mass and equal to or less than 0.8% by mass, based on 100% by mass of the total amount of the resin composition for fixing according to the present invention. By adjusting the colorant amount within the above range, a color impurity removal step is not required and thus the workability is improved. Therefore, it is possible to achieve a rotor that has a high output.
[000198] The amount of the release agent in the present embodiment is not particularly limited, but is preferably, for example, equal to or greater than 0.01% by mass and more preferably equal to or greater than 0.05% by mass, based on 100% by mass of the total amount of resin composition for fixing in accordance with the present embodiment. Furthermore, the amount of the release agent is, for example, preferably equal to or less than 1% by mass, more preferably equal to or less than 0.5% by mass, even more preferably equal to or less than 0.2 % by mass is particularly preferably equal to or less than 0.1% by mass. Generally, when a semiconductor integrated circuit is transfer molded, it is known to add a certain amount of a release agent in order to ensure the release of a fixture member from a mold.
[000199] The amount of the low voltage agent in the present embodiment is preferably equal to or greater than 0.01% by mass and equal to or less than 3% by mass and more preferably equal to or greater than 0.05% by mass and equal to or less than 2% by mass, based on 100% by mass of the total amount of resin composition for fixing in accordance with the present embodiment. When the amount of the low tension agent is within the aforementioned range, the durability during rotation at high speed is further improved.
[000200] The amount of ion scavenger in the present embodiment is preferably equal to or greater than 0.01% by mass and equal to or less than 3% by mass and more preferably equal to or greater than 0.05% by mass and equal to or less than 2% by mass, based on 100% by mass of the total amount of resin composition for fixing in accordance with the present embodiment. When the amount of ion scavenger is within the aforementioned range, durability during rotation at high speed is further improved.
[000201] The amount of the agent that confers adhesion in the present modality is preferably equal to or greater than 0.01% by mass and equal to or less than 3% by mass and more preferably equal to or greater than 0.05% by mass and equal to or less than 2% by mass, based on 100% by mass of the total amount of resin composition for fixing in accordance with the present embodiment. When the amount of the adhesion imparting agent is within the aforementioned range, the durability during rotation at high speed is further improved.
[000202] (Preparation Method of Resin Composition for Fixation)
[000203] The method of preparing the resin composition for fixing according to the present embodiment is not particularly limited, but it can be carried out as follows. First, a thermosetting resin (A), a phenolic resin based curing agent (B) and an inorganic filler mass (C) and preferably other additives or the like are blended in predetermined amounts. Then, the mixture is uniformly pulverized and mixed at normal temperature using, for example, a mixer, a jet mill, a ball mill or the like. Then, the setting resin composition is melt kneaded using a kneading machine such as a heating roller, kneader or an extruder by heating it to approximately 90°C to 120°C. Then, the resin composition for fixing after cooling is cooled and pulverized to obtain a solid fixing resin composition in the granule or powder shape. By properly adjusting the conditions of these preparation steps, it is possible to obtain the resin composition for fixing which has the desired dispersivity and flowability, etc.
[000204] The particle size of the powder or granule of the resin composition for fixing according to the present embodiment is preferably, for example, equal to or less than 5 mm. By adjusting the particle size to equal to or less than 5 mm, it is possible to inhibit the generation of fill failure during tablet production or an increased imbalance in tablet mass.
[000205] Furthermore, it is possible to obtain a tablet by tablet molding the powder or granule of the resin composition for fixation obtained. As a device used in tablet molding, a rotary tabletting machine of single dose or multiple communication type can be used. The shape of the tablet is not particularly limited, but is preferably cylindrical. The male type, female type and ambient temperatures of the tabletting machine are not particularly limited, but are preferably equal to or less than 35°C. If the temperature exceeds 35°C, the viscosity of the resin composition for fixing increases by the reaction thereof and thus the flowability may deteriorate. The tablet production pressure is preferably within the range of equal to or greater than 400 x 104 Pa and equal to or less than 3,000 x 104 Pa. Adjusting the tablet production pressure to equal or less than the upper limit , it is possible to prevent tablet fracture from occurring immediately after tablet production. However, by adjusting the tablet production pressure to equal or greater than the lowest limit, it is possible to prevent tablet fracture due to insufficient aggregation force of a tablet from occurring during transport. The material of the male or female molds of the tablet making machine and the surface treatment thereof are not particularly limited and known materials can be used. In addition, examples of surface treatment include electrical discharge processing, coating with a release agent, plating treatment and polishing.
[000206] Furthermore, the glass transition temperature (Tg) of the fixation member according to the present embodiment is preferably equal to or greater than 130°C and more preferably equal to or greater than 140°C. When the glass transition temperature (Tg) is equal to or greater than the lower limit, you can expect reliability improvement. The upper limit of the glass transition temperature (Tg) is not particularly limited, but is preferably equal to or less than 200°C and more preferably equal to or less than 190°C. By adjusting the glass transition temperature within the above range, it is possible to achieve a rotor that has excellent durability.
[000207] Furthermore, in the present modality, the glass transition temperature (Tg) can be increased, for example, by raising the softening point of the epoxy resin or the curing agent.
[000208] The flexural strength of the fixation member according to the present embodiment at 150 °C is preferably equal to or greater than 70 MPa and more preferably equal to or greater than 100 MPa. When the flexural strength is equal to or greater than the lower limit, cracks are not easily generated and reliability improvement can be expected. The upper limit of flexural strength is not particularly limited, but is preferably equal to or less than 300 MPa and more preferably equal to or less than 250 MPa. By adjusting the flexural strength within the above range, it is possible to achieve a rotor that has excellent durability.
[000209] In the present embodiment, the flexural strength can be increased, for example, by subjecting the surface of the filling mass to treatment with the use of a coupling agent.
[000210] The upper limit of the flexural elastic modulus of the fixation member according to the present invention at 150 °C is preferably equal to or less than 1.6 x 104 MPa and more preferably equal to or less than 1.3 x 104 MPa. When the flexural elastic modulus is equal to or less than the upper limit, reliability improvement can be expected due to stress relaxation. The lower limit of the flexural elastic modulus is not particularly limited, but is preferably equal to or greater than 5,000 MPa and more preferably equal to or greater than 7,000 MPa. By adjusting the flexural elastic modulus within the above range, it is possible to achieve a rotor that has excellent durability.
[000211] Additionally, in the present embodiment, the flexural elastic modulus can be decreased, for example, increasing the amount of addition of a low tension agent or decreasing the amount of blending of the filler.
[000212] In the fastening member according to the present embodiment, the coefficient of linear expansion (a1) over a temperature range of 25 °C or more and the glass transition temperature (Tg) or less is preferably equal to or greater than 10 ppm/°C and equal to or less than 25 ppm/°C and more preferably equal to or greater than 15 ppm/°C and equal to or less than 20 ppm/°C. When the coefficient of linear expansion (a1) is within the above ranges, it is possible to achieve the small difference in thermal expansion between the clamping member and an electromagnetic steel plate and to prevent the magnet from falling. As a result, it is possible to achieve a rotor that has excellent durability.
[000213] Additionally, in the present modality, the coefficient of linear expansion (a1) can be decreased, for example, increasing the amount of mixture of the inorganic filling mass.
[000214] In the fixation member according to the present embodiment, the coefficient of linear expansion (a2) in a temperature range that exceeds the glass transition temperature (Tg) is preferably equal to or greater than 10 ppm/°C and equal to or less than 100 ppm/°C and more preferably equal to or greater than 20 ppm/°C and equal to or less than 80 ppm/°C. When the coefficient of linear expansion (a2) is within the above ranges, it is possible to achieve the small difference in thermal expansion between the clamping member and an electromagnetic steel plate and to prevent the magnet from falling. As a result, it is possible to achieve a rotor that has excellent durability.
[000215] Additionally, in the present modality, the coefficient of linear expansion (a2) can be decreased, for example, increasing the amount of mixture of the inorganic filling mass.
[000216] (Rotor Manufacturing Method)
[000217] The method of manufacturing the rotor 100 according to the present modality is exemplified as follows. The first step is the preparation of the rotor core 110 provided with a plurality of orifice portions 150 disposed along the peripheral portion of a through hole through which the pivot axis 170 penetrates. Subsequently, the magnet 120 is inserted into the orifice portion 150. Subsequently, the resin composition for fixing is loaded into a separating portion 140 between the orifice portion 150 and the magnet 120. Subsequently, the resin composition is cured to obtain a clamping member 130. Subsequently, the shaft 170 is inserted into the through hole of the rotor core 110 by clamping and installing the shaft 170 in the rotor core. Using the aforementioned manufacturing method, it is possible to obtain the rotor 100 according to the present embodiment.
[000218] In the present embodiment, an insert molding is preferably used as a technique used to fill the separating portion 140 with the resin composition for fixation. Hereinafter, insert molding will be described in detail.
[000219] First, the description of an insert molding device is given as follows. Figure 10 is a cross-sectional view of the upper mold 200 of an insert molding device used in insert molding.
[000220] As an example of a method of forming the clamping member 130, a method can be used in which insert molding is performed using the resin composition for clamping in tablet form. An insert molding device is used for this insert molding. This insert molding device includes the upper mold 200 equipped with the pot 210, into which the resin composition for fixing in tablet form is supplied and the flow passage 220 for transferring the resin composition for fixing in the molten state; the lower mold (which is not illustrated); the heating unit that heats the upper mold 200 and the lower mold; and the extrusion unit which extrudes the resin composition for melt fixation. The insert molding device can be provided with, for example, a transport function for transporting a rotor core or the like.
[000221] It is preferred that the upper mold 200 and the lower mold, respectively, adhere to the upper surface and the lower surface of the rotor core 110 during insert molding. For this reason, the upper mold 200 and the lower mold are in a plate shape, for example. The upper mold 200 and the lower mold of the preset modality are different from a conventional mold for a transfer molding, which is used in a method of preparing a semiconductor device, in that the upper mold 200 and the lower mold do not cover fully rotor core 110 during insert molding. In other words, the upper mold 200 and the lower mold according to the pre-established mode do not cover the side surfaces of the rotor core 110. However, the mold for the transfer molding is configured so that the entire semiconductor integrated circuit is arranged in a cavity comprised of an upper mold and a lower mold.
[000222] Furthermore, as shown in Figure 10, pot 210 can have two independent flow passages 220. In this case, two flow passages 220 that are connected to a pot 210 are arranged in a Y-shape. It is possible to fill the fixing resin composition in accordance with the present embodiment in two orifice portions 150 of a pot 210. In addition, a pot 210 may have only one flow passage used to fill the fixing resin composition into an orifice portion 150 and may also have three or more flow passages used to fill the resin composition for fixation in three or more orifice portions 150. When a pot 210 has a plurality of flow passages 220, a plurality of passages 220 streams may be independent of each other, but may be continuous.
[000223] Subsequently, insert molding according to the present embodiment is described.
[000224] First, a rotor core 110 is preheated in an oven or a heat plate and then fixed to the lower mold of the molding device which is not shown in the drawing. Subsequently, the magnet 120 is inserted into the orifice portions 150 of the rotor core 110. Subsequently, the lower mold is raised and the upper surface of the rotor core 110 is pressed into the upper mold 200. Thereby, the upper surface and the surface The lower part of the rotor core 110 are sandwiched between the upper mold 200 and the lower mold and respectively inserted therein. At that time, the distal end portion of the flow passage 220 in the upper mold 200 is disposed at the separation portion 140 between the orifice portion 150 and the magnet 120. In addition, the rotor core 110 is heated by heat transfer from the lower mold and upper mold 200 of the molding device. The temperatures of the lower mold and the upper mold 200 of the molding device are controlled to, for example, approximately 150°C to 200°C, which is suitable for molding and curing the resin composition for fixing the rotor core 110. In this state, the tablet-shaped fixing resin composition is supplied to the pot 210 of the upper mold 200. The tablet-shaped fixing resin composition, which is supplied to the pot 210 of the upper mold 200, is heated in the pot 210 and arrives in the molten state.
[000225] Subsequently, the resin composition for fixing in the molten state is extruded from the pot 210 by a plunger (extrusion mechanism). As a result, the fixing resin composition moves through the flow passage 220 and is loaded into the separating portion 140 between the orifice portion 150 and the magnet 120. While the fixing resin composition is loaded into the separating portion 140 , the rotor core 110 is heated by heat transfer from the mold (the lower mold and the upper mold 200). The fastening resin composition loaded in the separating portion 140 is cured by heating the rotor core 110 to thereby form the fastening member 130.
[000226] At that time, the temperature conduction for curing the resin composition for fixing can be set to, for example, 150°C to 200°C. Furthermore, the cure time can be set to, for example, 30 seconds to 180 seconds. Through these conditions, the magnet 120 inserted into the orifice portion 150 is fixed by the fixing member 130. Then, the upper mold 200 is separated from the upper surface of the rotor core 110. Then, the shaft 170 is inserted into the through hole of the rotor core 110 and shaft 170 are fixed and installed on rotor core 110.
[000227] With the use of the manufacturing method mentioned above, it is possible to obtain the rotor 100 of the present mode.
[000228] The insert molding method according to the present embodiment is different from a transfer molding method used to manufacture a semiconductor device in that demolding is not required.
[000229] In the insert molding method, the resin composition for fastening is loaded to the orifice portion 150 of the rotor core 110 through the flow passage 220 of the upper mold 200 under the condition that the upper surface of the rotor core 110 adheres to the upper mold 200. As a result, the resin is not loaded between the upper surface of the rotor core 110 and the upper mold 200, gripping and detachment between the upper mold 200 and the upper surface becomes easier.
[000230] However, in the transfer molding method, a resin is loaded into a cavity between a semiconductor integrated circuit and a mold and thus, it is necessary to perform demolding of the molded article in a satisfactory manner. As a result, release properties between the mold and the molded article are particularly required for a resin that seals a semiconductor chip.
[000231] The rotor 100 of the present embodiment can be mounted on transport units such as trains, boats, ships and electric vehicles such as hybrid cars, fuel cell cars and electric cars.
[000232] Examples
[000233] Hereinafter, the present invention will be described in detail with reference to the examples, but the present invention is not limited to the description in the examples in any way. Unless otherwise specified, the “part(s)” and “%” as described below denote “part(s) by mass” and “% by mass”, respectively.
[000234] The raw material components used in the respective Examples and Comparative Examples are shown below.
[000235] (Thermofix resin (A))
[000236] Epoxy resin 1: Novolac type epoxy resin from orthocresol (manufactured with DIC Corporation, EPICLON N-670)
[000237] Epoxy resin 2: Novolac type epoxy resin of orthocresol (manufactured by Nippon Kayaku Co., Ltd., EOCN-1020-55)
[000238] Epoxy resin 3: the manufacturing method is described below.
[000239] (Healing agent (B))
[000240] Phenolic resin based curing agent 1: Novolac type phenolic resin (manufactured with Sumitomo Bakelite Co., Ltd., PR-HF-3)
[000241] Phenolic resin based curing agent 2: Novolac type phenolic resin (manufactured by Sumitomo Bakelite Co., Ltd., PR-51470)
[000242] Phenolic resin based curing agent 3: Phenolaralkyl resin type phenolic resin (manufactured by Meiwa Plastic Industries, Ltd., MEH-7851SS)
[000243] (Inorganic charge (C))
[000244] Spherical Silica 1 (manufactured together with Denki Kagaku Kogyo Kabushiki Kaisha, FB-950, mean particle diameter D50 23 μm, maximum particle diameter Dmax 71 μm)
[000245] Spherical silica 2 (manufactured with Denki Kagaku Kogyo Kabushiki Kaisha, FB-35, mean particle diameter D50 10 μm, maximum particle diameter Dmax 71 μm)
[000246] (Cure Accelerator (D))
[000247] Curing accelerator: Triphenylphosphine (manufactured by K-I Chemical Industry Co., Ltd. PP-360)
[000248] (Silane Coupling Agent (F))
[000249] Silane Coupling Agent 1: y-Aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBE-903)
[000250] Silane Coupling Agent 2: Phenylaminopropyltrimethoxysilane (manufactured by Dow Corning Toray Co., Ltd., CF4083)
[000251] Silane Coupling Agent 3: y-Glycidoxypropyltrimethoxysilane (manufactured by Chisso Corporation., GPS-M)
[000252] Silane Coupling Agent 4: y-Mercaptopropyltrimethoxysilane
[000253] (Other additives)
[000254] Release agent: Carnauba wax (manufactured together with Nikko Fine Corporation, Nikko Carnauba)
[000255] Ion Cleaner: Hydrotalcite (manufactured by Kyowa Chemical Industry Co., Ltd., trade name DHT-4H)
[000256] Colorant: Carbon black (manufactured with Mitsubishi Chemical Corporation, MA600)
[000257] Triazole: 3-Amino-1,2,4-triazol-5-thiol
[000258] Low Tensile Agent: Silicone resin (manufactured together with Shin-Etsu Chemical Co., Ltd., KMP-594)
[000259] Flame Retardant: Aluminum hydroxide (manufactured together with Sumitomo Chemical Co., Ltd., CL-303, mean particle diameter D50 3.5 μm,)
[000260] Hereinafter, the production method of epoxy resin 3 will be described. First, the synthesis method of the precursor phenol resin (P1), which was used for the synthesis of epoxy resin 3, will be described.
[000261] For the phenol resin (P0) which was the starting material, the phenolaralkyl resin containing phenylene structure (manufactured by Meiwa Plastic Industries, Ltd., MEH-7800SS, hydroxide equivalent 175 g/eq, softening point 67°C) 525 parts by weight, 1-chloromethylnaphthalene (manufactured by Tokyo Chemical Industry Co., Ltd., melting point 20°C, molecular weight 176.6, purity 99.1%) 53 parts by mass, methyl isobutyl ketone 580 parts by mass and tetraethylammonium chloride (manufactured by Tokyo Chemical Industry Co., Ltd., melting point 39°C, molecular weight 176.6, purity 99.1%) 6 parts by dough were weighed and added to the separable jar. Then, the separable flask was equipped with the stirring machine, the thermometer, the reflux condenser and nitrogen inlet, and the stirring was carried out with nitrogen bubbling to dissolve the components.
[000262] Then, heating started and 27 parts by mass of 49% aqueous sodium hydroxide solution (0.33 mol) were gradually added to the system while maintaining its temperature within the range of 65°C or more and 75°C or less. Then, the reaction temperature was raised and the reaction proceeded for 3 hours while keeping the reaction temperature within the range of 95°C or more and 105°C or less. After completion of the reaction, the reaction system was cooled to room temperature. Subsequently, 10 parts by mass of monosodium sulfate was added thereto to carry out the neutralization. The process (water washing) of adding 300 parts of distilled water to the reaction mixture, stirring the reaction mixture and removing the aqueous layer was repeated until the washing water became neutral. Then, the methyl isobutyl ketone was distilled at 125 °C under the condition of depressurization of 2 mmHg to thereby obtain the precursor phenol resin (P1) represented by formula (I) below (c represents an integer from 1 to 20, d represents an integer from 0 to 20 and both ends of the structural formula are hydrogen atoms. In the polymer of d=0, c represents an integer from 2 to 20, the repeating units of the phenyl aralkyl groups ((c-1) ) pieces) must be inserted between the repeating units of the hydroxyphenylene groups (c pieces). In the polymer of d>1, (c+d) represents an integer from 2 to 20, the repeating units of the hydroxyphenylene group (c pieces) and the repeating units of the naphthylmethoxyphenylene group (d pieces) can be consecutively aligned or can be alternatively or randomly aligned since the repeating units of the phenyl aralkyl groups ((c+d-1) pieces) need to be inserted between the aforementioned repeating units . 210 hydroxide agent).
[000263] Chemical Formula 8

[000264] In the following, the epoxy resin 3 synthesis method with the use of the precursor phenol resin (P1) will be described.
[000265] The separable flask was equipped with the stirring machine, the thermometer, the reflux condenser and a nitrogen inlet and then 500 parts by mass of the precursor phenol resin (P1), 1,320 parts by mass of epichlorohydrin and 260 parts by mass of dimethylsulfoxide were added thereto. After the reaction mixture was heated to 45 °C and dissolved, 97 parts by mass of sodium hydroxide (solid fine grain format, 99% purity) was added to it for 2 hours. Then, the reaction temperature was raised to 50°C and the reaction continued for 2 hours. Furthermore, the reaction temperature was raised to 70°C and the reaction continued for 2 hours. After the reaction, the process (washing in water) of adding 300 parts of distilled water to the reaction mixture, stirring the reaction mixture and removing the aqueous layer was repeated until the washing water became neutral. Then, the epichlorohydrin and the dimethylsulfoxide from the oil layer were distilled at 125 °C under the condition of depressurization of 2 mm of Hg. 1100 parts by mass of methyl isobutyl ketone were added to the obtained solid production to dissolve the obtained solid production therein, and the solution was heated to 70°C. Then, 31 parts of 30% by mass of aqueous sodium hydroxide solution were added to it for 1 hour and the reaction continued for 1 hour. Then, the reaction system was removed to remove the aqueous layer. Then, 150 parts by mass of distilled water was added to the oil layer to carry out the water wash process and this water wash process was repeated until the wash water became neutral. After the process of washing in water, the methyl isobutyl ketone was distilled through heating and depressurization to thus obtain the epoxy resin 3 represented by formula (II) below
[000266] (c represents an integer from 1 to 20, d represents an integer from 0-20 and both ends of the structural formula are hydrogen atoms. In the polymer of d=0, c represents an integer from 2- 20, the repeating units of the aralkyl phenyl groups ((c-1) parts) need to be inserted between the repeating units of the substituted or unsubstituted glycidoxyphenylene groups (c parts) In the polymer of d>1, (c+d) represents an integer from 2 to 20, the repeating units of the substituted or unsubstituted glycidoxyphenylene groups (c pieces) and the repeating units of the naphthylmethoxyphenylene group (d pieces) can be consecutively aligned or can be alternatively or randomly aligned provided that the repeating units of the phenyl aralkyl groups ((c+d-1) parts) need to be inserted between the aforementioned repeating units. Epoxy Equivalent 281, Softening point 56 °C, ICI viscosity at 150 °C of 1.0 dPa's).
[000267] Chemical Formula 9

[000268] In Examples 1 to 4, the inorganic filler mass (C), which had previously been subjected to the silane coupling treatment, was used as the treated silica. The silane coupling treatment for the inorganic filler mass (C) was carried out as follows.
[000269] Firstly, spherical silica 1 and spherical silica 2 were respectively dried at 105°C for 12 hours. Subsequently, spherical silica 1 of 60 parts by weight and spherical silica 2 of 20 parts by weight were added to the mixer and stirred for 10 minutes. Subsequently, the mixture of spherical silica 1 and spherical silica 2 was stirred for 20 minutes by spraying 0.3 parts by mass silane coupling agent 1 into the mixture. The sparging time of silane coupling agent 1 was approximately 10 minutes. Also, the moisture in the blender was 50% or less. Then, stirring was continued for 60 minutes to mix the silica and silane coupling agent 1.
[000270] Then, the mixture was removed from the mixer and was subjected to the aging treatment under the condition of 20±5 °C for 7 days. Then, the mixture was sieved with 200 mesh to remove the coarse particles. Through the treatment mentioned above, the inorganic filler mass (C) subjected to the silane coupling treatment was obtained. In the present document, the ribbon beater was used as the mixer. Also, the rotation frequency of the tape beater was 30 rpm.
[000271] The silane coupling agents 2, 3 and 4 were added to the resin.
[000272] (Examples and Comparative Examples)
[000273] In the Examples and Comparative Examples, the mixture, which was formed by mixing the respective components according to the amount of mixtures shown in the Tables, was mixed at a normal temperature using a mixer to obtain the powdery intermediate. The pulverulent intermediate obtained was loaded into an automatic feeder (dispenser), quantitatively supplied to a heating roller at 80 °C to 100 °C and melted. Then, the intermediate was cooled and then pulverized to obtain the resin composition for fixing. The obtained fixation resin composition was molded into tablet using the molding device to obtain the tablet.
[000274] For the resin composition for fixation obtained, measurements and evaluations as shown below were carried out.
[000275] In Examples 1 to 4 and Comparative Examples 1 to 3, curing under the condition of heating at 175 °C for 4 hours was carried out to obtain the cured product of the resin composition for impeller fixing. In addition, for the measurement described below, the cured product of the resin composition for impeller fixing was molded into shape in accordance with JIS K7162 and then cured to thereby obtain the test piece.
[000276] In addition, the blend proportions of the respective components in Examples 1 to 4 and Comparative Examples 1 to 3 are described in Tables 1 to 3.
[000277] Hereinafter, the measurements and evaluations, to which the respective cured products obtained using the blending proportions described in Tables 1 to 3 were submitted, are described below in detail.
[000278] (Evaluation items)
[000279] Tensile Elongation at Break: The cured product of the rotor fastening resin composition, which was molded into a dumbbell shape in accordance with JIS K7162 (hereinafter referred to as a test piece), was subjected to a test of voltage under the conditions of a temperature of 120 °C or 25 °C, a test load of 20 MPa and 100 hours. Then, the tensile elongation at break of the test piece was measured. The unit of the tensile elongation at break is %. Also, the elongation of stress at break is the value that is determined by charging and charging time. In particular, the tensile elongation at break is the value that can be obtained by the following equation where X0 mm represents the total length of the cured product molded into a dumbbell shape before a tension test and X1 mm represents the total length of the even after a voltage test. Furthermore, the creep testing machine (manufactured by A&D Company, Ltd., CP5-L-200) and strain gauge (manufactured by Kyowa Electronic Instruments Co., Ltd., KFG-5-120) were used in the measurement of stress elongation at break.
[000280] Elongation of stress at rupture [%] = {(X1 mm - X0 mm) / Xo mm} x 100
[000281] Elastic modulus: The cured product of the rotor fastening resin composition, which had been molded into a dumbbell shape in accordance with JIS K7162 (hereinafter referred to as a test piece), was subjected to the 100-hour tension test under the conditions of a temperature of 120°C or 25°C, a test load of 20 MPa and 100 hours. The elastic modulus unit was set to MPa.
[000282] The evaluation results in relation to the aforementioned evaluation items are shown in Tables 1 to 4 below together with the blend proportions of the respective components. In this document, “O” represents presence and “x” represents absence. Table 1

Table 2

Table 3

Table 4


[000283] A-break strain elongation is the barometer that indicates the durability of a permanent magnet in a rotor core. In particular, when a rotor fastening resin composition with small a-break stress elongation is used as a material, it is possible to obtain a rotor core excellent in positional stability and durability. As can be seen from Table 4, the cured products of Examples 1 to 6 had lower α-break stress elongation values than those of Comparative Examples. These results reveal that it is possible to obtain a rotor core excellent in deformation resistance, positional stability and durability when rotor cores are produced using the resin compositions for rotor fixing having the compositions described in the Examples.
[000284] In the resin compositions for rotor fixing described in Examples 1 to 6, the blending optimizations of a resin composition, the silica surface treatment (drying treatment, f management, aging time) and other treatments were performed to improve the strain-in-break elongation a. In Examples 1 to 6, optimizations were carried out using the unconventional refinements in the process and the details of these are described below.
[000285] In particular, the technical refinements performed in Example 1 included the presence of 2 types of the epoxy resins containing the innovative 3 epoxy resin, the use of 2 types of the phenolic resin-based curing agents and the optimization of the treatment of silane coupling to the inorganic filler mass (C). The technical refinements performed in Example 2 included the optimization of the silane coupling treatment in the inorganic filler mass (C). The technical refinements performed in Example 3 included the absence of wax and optimization of the silane coupling treatment for the inorganic filler mass (C). The technical refinements performed in Example 4 included the presence of the innovative epoxy resin, the use of 3 types of the phenolic resin-based curing agents, the absence of wax and the optimization of the silane coupling treatment for the inorganic filler ( Ç). The technical refinements performed in Example 5 included the presence of 2 types of the epoxy resins containing innovative epoxy resin 3, the use of 2 types of the phenolic resin based curing agents, and the optimization of the silane coupling treatment for the mass of inorganic filler (C). The technical refinements carried out in Example 6 include the presence of innovative epoxy resin 3 and the optimization of the silane coupling treatment for the inorganic filler mass (C). NUMERICAL REFERENCE LIST 100 ROTOR 110 ROTOR NUCLEUS 112 ELECTROMAGNETIC STEEL PLATE 116 GROOVES 118a END PLATE 118b END PLATE 120 MAGNET 121 SIDE WALL 123 SIDE WALL 127 SIDE WALL 130 PREIXATION MEMBER 132 MEMBER MEMBER SLACK 140 SEPARATION PORTION 150 ORIFICE PORTION 151 SIDE WALL 152 SLACK 153 SIDE WALL 154a ORIFICE PORTION 154b ORIFICE PORTION 155 SIDE WALL 156 SIDE WALL PORTION 157 SIDE WALL 160 PORTION FORGE PRINTING 200 MOLD 170 E FLOW PASSAGE

权利要求:
Claims (8)
[0001]
1. Resin composition for rotor fastening for use in forming a fastening member (130) constituting a rotor (100) including: a rotor core (110) fastened and installed on a rotating shaft (170) at the which a plurality of orifice portions (150) disposed along the peripheral portion of the pivot axis (170) are formed; a magnet (120) inserted into the orifice portions (150); and the clamping member (130) securing the magnet (120), the clamping member (130) provided in a separating portion (140) between the orifice portion (150) and the magnet (120), and at minus one side wall positioned on an inner peripheral side of the rotor core (110), outside the side walls of the magnet (120), the resin composition for fixing the rotor, characterized by the fact that it comprises: a thermosetting resin which contains epoxy resin; a healing agent; an inorganic filler mass, a coupling agent, wherein: the resin composition for impeller fixing is in a powder form, a granule form or a tablet form, an elongation of tensile strength at 120° C is 0.1% or greater and 1.7% or less, where an elastic modulus of the product cured at 120°C is 0.8 x 104 MPa or greater, where the tensile elongation at break a-calculated by following Equation, where X0 mm represents the total length of the test piece before a tension test, and X1 mm represents the total length of the test piece after the tension test, where the elongation of tension in a-break is obtained by subjecting a test piece to a tension test in accordance with JIS K7162 under conditions of a temperature of 120°C, a test load of 20 MPa and 100 hours, using a creep testing machine and a strain gauge for a measurement of strain elongation at break: Equation: strain elongation at break [%] = {(X1 mm - Xo mm) / Xo mm} x 100, and the test piece is a cured product produced by subjecting the rotor fastening resin composition to cure by heating at 175°C for 4 hours and molding into a corresponding dumbbell shape. with JIS K7162.
[0002]
2. Resin composition for rotor fastening, according to claim 1, characterized in that an elongation of stress at break-b is 0.1% or greater and 0.5% or less, wherein the elongation of breaking stress b-calculated by the following Equation, where X0 mm represents the total length of the test piece before a stress test, and X1 mm represents the total length of the test piece after the stress test, where the elongation tensile stress-b is obtained by subjecting a test piece to a tensile test under conditions of a temperature of 25°C, a test load of 20 MPa and 100 hours: Equation: elongation of tensile stress [% ] = {(X1 mm - X0 mm) / X0 mm} x 100 The test piece is a cured product produced by subjecting the rotor fastening resin composition to cure by heating at 175°C for 4 hours and molding up in a dumbbell shape in accordance with JIS K7162.
[0003]
3. Resin composition for rotor fastening according to claim 1 or 2, characterized in that the epoxy resin includes at least one selected from the group consisting of a biphenyl-based epoxy resin, an epoxy-based resin of phenolaralkyl, a phenol novolac based epoxy resin, an orthocresol novolac based epoxy resin, a bisphenol based epoxy resin, a bisnaphthol based epoxy resin, a dicyclopentadiene based epoxy resin, an epoxy resin based on dihydroanthracenediol and an epoxy resin based on triphenylmethane.
[0004]
4. Resin composition for fixing the rotor, according to any one of claims 1 to 3, characterized in that the curing agent includes at least one selected from the group consisting of a novolac-based phenolic resin, a phenolaralkyl resin, a naphthol-based phenolaralkyl resin and a phenolic resin formed by reacting hydroxybenzaldehyde, formaldehyde and phenol.
[0005]
5. Resin composition for fixing the rotor, according to any one of claims 1 to 4, characterized in that the epoxy resin is a crystalline epoxy resin.
[0006]
6. Resin composition for fixing the rotor, according to any one of claims 1 to 5, characterized in that a width of the separation portion (140) between the orifice portion (150) and the magnet (120) is 20 μm or greater and 500 μm or less.
[0007]
7. Rotor (100), characterized in that it comprises: a rotor core (110) fixed and installed on a rotating shaft (170), in which a plurality of orifice portions (150) are provided along the portion. slewing shaft peripheral (170); a magnet (120) inserted into the orifice portions (150); and a fastening member (130) provided in a separating portion (150) between the orifice portion and the magnet (120) wherein the fastening member (130) is formed using a resin composition for rotor attachment as defined in any one of claims 1 to 6.
[0008]
8. An automobile characterized by the fact that it is manufactured using the rotor (100), as defined in claim 7.

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同族专利:

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公开号 | 公开日

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KR20140135958A|2014-11-27|

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SG11201405065PA|2014-10-30|

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JP6469943B2|2019-02-13|

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CN104136532A|2014-11-05|

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US20150130318A1|2015-05-14|

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KR101995611B1|2019-07-02|

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CN104136532B|2016-05-18|

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JP2013209644A|2013-10-10|

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WO2013129598A1|2013-09-06|

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IN2014DN07130A|2015-04-24|

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TW201341462A|2013-10-16|

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EP2821437A4|2016-01-20|

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EP2821437A1|2015-01-07|

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法律状态:
2018-03-27| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|

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2019-11-05| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|

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2020-10-13| B07A| Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]|

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2021-03-09| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|

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2021-05-04| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 28/02/2013, OBSERVADAS AS CONDICOES LEGAIS. |

优先权:

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申请号 | 申请日 | 专利标题

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JP2012-045885|2012-03-01|

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JP2012045885|2012-03-01|

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PCT/JP2013/055487|WO2013129598A1|2012-03-01|2013-02-28|Resin composition for rotor fixing, rotor, and automotive vehicle|

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